Dishing & Erosion Phenomena in CMP Process and Their Solutions
In semiconductor manufacturing, Chemical Mechanical Polishing (CMP) is an essential process to planarize the wafer surface. However, CMP is not a perfect process and often causes two major defects: Dishing and Erosion. In this article, we will delve into the causes and mechanisms of these phenomena, and introduce metrology solutions to control them. 📌 What … Read more