Advanced IR Imaging Solution for Semiconductor Device Analysis
The KIR-6120 is a state-of-the-art Infrared (IR) inspection microscope specifically engineered for non-destructive internal analysis of semiconductor devices, such as Flip Chip and WLCSP (Wafer Level Chip Scale Package). Featuring a robust 12-inch wide platform, the system supports high-resolution imaging, ergonomic usability, and versatile optical configurations—making it the ideal solution for precise internal failure analysis, bonding integrity evaluation, and microstructural inspections.
🔍 Key Features & Advantages
🖥️ Dual Imaging System: IR & Visible
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Integrated dual-camera system using Visible CCD and IR InGaAs sensors.
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Enables simultaneous imaging of surface and subsurface features.
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Real-time comparison between visible and infrared views for enhanced defect detection.
📏 Precision Z-Height Measurement
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Equipped with high-resolution linear encoder, digital counter, and scale.
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Optional Z-axis measurement module for depth analysis and accurate sample profiling.
🔬 12-Inch Wide Inspection Stage
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Accommodates up to 300mm wafers, strips, or large substrates.
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Ideal for semiconductor applications requiring high flexibility in sample size and format.
💡 Advanced IR Illumination Capabilities
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Supports brightfield, darkfield, polarized light, and filter slot-based illumination.
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Optimized to highlight bonding defects, voids, and intermetallic anomalies in stacked and encapsulated structures.
🧠 Ergonomic and Operator-Friendly Design
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One-touch vision converter shuttle ensures seamless switching between modes.
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Tiltable trinocular eyepiece adapts to operator eye-level, minimizing fatigue during long sessions.
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All primary controls are embedded in the microscope base for intuitive use and minimized hand movement.
🧪 Industrial-Grade Optical Performance
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High-performance optics designed for critical semiconductor failure analysis, MEMS inspection, and SOI wafer quality control.
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Stable illumination with adjustable intensity ensures repeatable and artifact-free imaging.
🧩 Applications
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WLCSP (Wafer-Level CSP) Non-Destructive Testing
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Flip Chip Bonding Interface Inspection (Au-Al Intermetallic Analysis)
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Wire Bonding / Stud Bump Quality Control
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MEMS 3D Structural Inspection
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SOI Wafer Post-Grinding Evaluation
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Die Crack and Delamination Detection
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Underfill Voiding and Layer Interface Failure Analysis
🏆 Why Choose KIR-6120?
The KIR-6120 offers a comprehensive NDT solution for high-density, compact semiconductor packages. From backside silicon inspection to intermetallic detection in flip chips, this microscope sets the industry standard for IR inspection reliability and clarity. Whether deployed in R&D labs, failure analysis labs, or inline quality assurance environments, the KIR-6120 ensures engineers can make data-driven decisions based on highly accurate IR imaging.
👉 Contact us now to get an optimized setup recommendation for your process and samples.
We’re Here to Help
We warmly welcome any inquiries regarding product specifications or pricing.
With English-speaking staff on our team, we’re well-prepared to assist you efficiently and clearly.
Please don’t hesitate to contact me directly — I will personally respond to your email.
You can reach me at: hy.kang@kovistek.com