WARP-3500 Non-Contact High Precision Wafer Thickness & Shape Measurement System As semiconductor manufacturing continues to scale down to the nanometer level, precise control of wafer thickness (TTV) and warpage (WARP, Bow) has become one of the most critical factors in ensuring high production yield.Even slight variations in wafer thickness or flatness can cause alignment errors, … Read more
Introduction As wafer geometries become more complex and ultra-thin wafers are adopted across advanced semiconductor applications, precise and non-contact metrology becomes essential. The WARP-3500 series is an advanced Automatic Mapping Wafer Thickness Measurement System, capable of ultra-high precision thickness and shape measurements. With nanometer-level resolution, WARP-3500 provides reliable and safe solutions for even the most … Read more
ATLANTIS is a cutting-edge, high-performance In-Line Scanning Acoustic Tomography (SAT) C-SAM inspection system, designed to deliver exceptional speed and flexibility in high-volume production environments. It is optimized for a wide range of wafer-level products, including HBM, TSV, bonded wafers, stacked wafers, MEMS, chip-on-wafer, leadframe strips, power modules, and multi-layer ceramic chips, enabling fully automated inspection … Read more