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non-uniform metal line pattern

“Why Is My Metal Pattern Wavy?” — It’s Not the Plating, It’s What Came Before

7월 20, 2025 by woojong

If you’ve ever looked at your wafer after metal patterning and thought, “Why the hell does it look like a topographical map?”You’re not alone. Many engineers instinctively blame the plating process when they see wavy or bumpy metal lines.But in reality? The issue often starts way upstream.Let’s break it down. 🔍 What Does a “Wavy” … Read more

Categories Metrology Tools by Process Step Tags back end of line (BEOL) defects, CMP dishing erosion problem, copper seed layer deposition issue, electroplating defect on wafer, etch back process defects, metal deposition step coverage issue, metal layer roughness semiconductor, metal line distortion in IC, metal pattern defect semiconductor, metal topography variation, non-uniform metal line pattern, pattern height non-uniformity, photoresist bake effect on pattern, planarization failure metal pattern, seed layer non-conformality, semiconductor interconnect failures, surface roughness after plating, wafer bumping defect causes, wafer metrology metal layer, wafer topography defect analysis Leave a comment

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