Beyond Underfill: The Role of the Dam Process in C-SAM Detection
In semiconductor packaging, underfill plays a critical role in reliability. But have you ever wondered how the “dam” structure around it affects the detection of voids using C-SAM (Confocal Scanning Acoustic Microscopy)? Let’s take a closer look. What Is a “Dam” in the Underfill Process? In flip-chip packaging, a “dam” is a physical boundary—typically formed … Read more