Fully Automatic Thermal Warpage Metrology System
Your Next-Generation Solution for Real Reflow Thermal Warpage Analysis
❗ The Challenge
In today’s advanced semiconductor packaging processes, thermal warpage is no longer a side effect — it’s a critical parameter that directly impacts device yield, reliability, and structural integrity.
Traditional warpage evaluation systems require multiple manual steps, which often introduce significant measurement errors, reduce throughput, and delay decision-making in production.
The TMS Breakthrough
KOVIS Technology proudly introduces the TMS-3000/5000, a fully automated thermal warpage analysis system engineered to deliver true “as-is” measurement — without pre-processing, human intervention, or compromises on accuracy.
Why TMS-3000/5000 is a Game Changer
No Pre-treatment. No Compromises.
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No ball removal
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No white paint spray
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No thermal taping on thermocouples
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No manual handling
TMS measures IC packages exactly as they are, directly on tray, simulating real reflow environments — just load and start.
This eliminates operator-dependent variables and ensures true thermal deformation data.
Submicron Accuracy Meets Real-World Simulation
Powered by surrounding stereo DFP (Deflection Phase Profilometry) and proprietary high-resolution 3D moiré technology, TMS delivers:
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1μm Z-resolution
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±1μm accuracy
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Flexible field of view (up to 400x400mm)
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420 LPI grating resolution
This means faster, more precise insight into your product’s warpage behavior before it reaches the market.
🔄 Full Automation, True Efficiency
With automated tray-to-tray loading/unloading, integrated thermal profile generation, and real-time statistical analysis (SPC), TMS dramatically reduces cycle time while improving traceability, repeatability, and confidence.
Whether you’re handling BGA, WLP, Fan-Out, PLP, or molded wafers, TMS adapts to your workflow with unmatched precision.
Core Capabilities
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Real reflow simulation up to 280°C+
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Multi-axis strain & CTE analysis (X, Y, Z)
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Comprehensive surface morphology mapping
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Defect detection & reporting
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Supplier/process qualification & monitoring
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Lot-to-lot trend analysis & historical tracking
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Production floor ready / QA & QC integrated
Key Applications
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Semiconductor IC packaging (BGA, CSP, QFN)
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Wafer-Level Packaging (WLP), TSV, PLP
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Fan-Out Packaging, Molded wafers, Display substrates
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OLED modules, Solar cells, PCBs, SMT substrates
Optional Boosters
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Cooling Boost Module: For faster thermal cycling
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Large FOV Scaling: For oversized substrates
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Custom tray compatibility: For line integration
Ready to Transform Your Warpage Analysis?
If you’re still relying on white paint or operator-dependent methods for thermal warpage analysis, you’re falling behind.
With TMS-3000/5000, you’re not just analyzing warpage — you’re controlling it.
Let your R&D and production teams make faster, smarter, and more confident decisions with real data from real conditions.
📩 Request a Live Demo or Technical Consultation Today
✅ Reduce human error
✅ Shorten qualification time
✅ Improve yield and quality
✅ Optimize your reflow profile
✅ Be ready for tomorrow’s advanced packaging challenges