WARP-3500
Non-Contact High Precision Wafer Thickness & Shape Measurement System
As semiconductor manufacturing continues to scale down to the nanometer level, precise control of wafer thickness (TTV) and warpage (WARP, Bow) has become one of the most critical factors in ensuring high production yield.
Even slight variations in wafer thickness or flatness can cause alignment errors, bonding failures, and crack formation during packaging or back-end processes.
In advanced packaging such as 3D stacking and heterogeneous integration, maintaining uniform wafer thickness and flatness directly determines process stability. At the same time, the industry trend toward larger, thinner wafers demands ultra-stable, non-contact optical metrology solutions with sub-micron precision.
This is where WARP-3500 defines the next generation of wafer measurement technology.
Overview
WARP-3500 is a non-contact, high-precision wafer metrology system designed to measure thickness, TTV (Total Thickness Variation), flatness, and warpage/bow at nanometer-level resolution.
It provides stable, repeatable measurements for a wide range of thin materials used in semiconductor, display, and advanced materials industries.
Key Features
1. Non-Contact Ultra Precision Measurement
Achieves ≤ ±0.25 µm accuracy using a non-contact optical method — ensuring safe and reliable measurements without material damage.
2. Versatile Sample Compatibility
Supports bare, patterned, ring-framed (on tape), bump, and Taiko wafers.
Compatible with a wide range of materials such as Si, Ge, GaAs, InP, glass, sapphire, solar cell, FPD, strip, and PCB.
3. Ultra-Thin Wafer Capability
Measures wafers as thin as 50 µm, ideal for back-grinding, thin wafer processing, and 3D packaging applications.
4. Automatic Multi-Point e-Mapping
Fully automated mapping using user-defined recipes.
Precision XY & Z1/Z2 linear motor stages with encoders ensure high repeatability and fast throughput.
5. User-Friendly Interface
Windows-based One-Click operation with intuitive control.
Measurement results are visualized in 2D/3D graphical formats for easy analysis.
6. Automation Ready
Seamlessly integrates with semiautomatic and fully automatic systems.
Supports factory automation, SPC data management, and inline process monitoring.
Optional Modules
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Vision Auto-Focus (Bump or Die Height, Tape Thickness, Edge Inspection)
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Thin Film & BLT (Bonded Layer Thickness) Measurement
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3D Surface Profiling & Roughness Measurement
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Multi-Sensor Integration: Confocal, IR, Air Touch, White Light Interferometer, etc.
Why WARP-3500 Matters
In today’s semiconductor ecosystem, yield enhancement and process reliability depend on precision wafer metrology.
As devices move toward AI, automotive, and high-density packaging, the ability to control thickness uniformity, warpage, and bow has become a key differentiator.
WARP-3500 enables engineers to:
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Detect warpage or TTV deviations early
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Optimize grinding and polishing parameters
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Improve bonding alignment and stacking yield
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Reduce wafer breakage and process downtime
Summary
WARP-3500 delivers the perfect combination of non-contact precision, automation, and multi-material compatibility.
It is more than just a wafer thickness measurement tool — it is a comprehensive wafer shape analysis system for next-generation semiconductor manufacturing.
For fabs and R&D centers aiming for higher yield, faster throughput, and process stability,
WARP-3500 is the metrology solution that ensures measurable performance.
Contact & Demo Request
WARP-3500 is more than a measurement instrument —
it’s a key enabler for process quality, efficiency, and reliability.
We’re Here to Help
We warmly welcome any inquiries regarding product specifications or pricing.
With English-speaking staff on our team, we’re well-prepared to assist you efficiently and clearly.
Please don’t hesitate to contact me directly — I will personally respond to your email.
You can reach me at: hy.kang@kovistek.com