Introduction
As wafer geometries become more complex and ultra-thin wafers are adopted across advanced semiconductor applications, precise and non-contact metrology becomes essential. The WARP-3500 series is an advanced Automatic Mapping Wafer Thickness Measurement System, capable of ultra-high precision thickness and shape measurements. With nanometer-level resolution, WARP-3500 provides reliable and safe solutions for even the most challenging wafer types, including Taiko wafers, laminated wafers, bump wafers, and tape-mounted wafers.
Key Features
⚙️ High-Speed, High-Precision Measurements
- Fast and accurate non-contact measurement of wafer thickness, TTV (Total Thickness Variation), flatness, and warpage.
- Measurement of electrical resistivity, PN junction types, and mass (optional).
- R-theta high-speed scanning stage enables rapid and efficient wafer scanning.
- Fully automated classification by measurement type (5-category binning).
🧠 Intelligent Automation
- Supports automatic handling systems such as Open CSST, LPM, ATM, and SMIF.
- Integrated PN junction detection sensor.
- Automated LD/ULD wafer loading and alignment.
- Real-time notch detection and edge shape characterization.
🛡️ Safety & Reliability for Fragile Wafers
- Vacuum chuck system to safely support ultra-thin and delicate wafers.
- Ideal for back grinding, lamination, and post-process measurement.
🔍 Versatile Measurement Capability
- Supports a wide range of wafer types including:
- Bare wafers and patterned wafers
- Backgrind ring-frame wafers
- Tape-mounted and Taiko wafers
- Bumped wafers and ultra-thin wafers
System Highlights
🧪 Sensor Technology
- Multiple sensor options available:
- Capacitive sensors
- Confocal sensors
- Infrared (IR) sensors
- CLS (Chromatic Length Sensor)
- Air-gap sensors
📊 Precision & Output
- Resolution: 10 nm
- Repeatability: < 0.25 µm
- Output formats: CSV, TXT, and SPC-compatible data export
- Visual 2D/3D graphic representations of results for intuitive analysis
🧩 Software Interface
- User-friendly, intuitive measurement software designed for efficient operation
- Compatible with MES and remote diagnostics for smart fab integration
Applications
📌 Material & Wafer Types
- Compatible with a wide variety of substrates:
- Silicon (Si)
- Germanium (Ge)
- Gallium Arsenide (GaAs)
- Indium Phosphide (InP)
- Glass and Sapphire
- Solar cell wafers
- Flat Panel Display (FPD) glass
- Strip and PCB substrates
📦 Packaging Technologies
- Optimized for advanced packaging applications:
- 2.5D/3D IC packaging
- Fan-out and Fan-in WLP
- Panel Level Packaging (PLP)
Conclusion
The WARP-3500 stands as a cutting-edge solution for wafer thickness and shape measurement in the era of advanced semiconductor manufacturing. It addresses the need for precision, reliability, and high-speed automation in evaluating complex wafer structures. Whether for front-end or back-end processes, WARP-3500 provides fabs with the metrology confidence required to achieve the highest yields and maintain process integrity.
For fabs transitioning into advanced nodes and heterogeneous integration, WARP-3500 is an indispensable metrology platform that supports innovation while safeguarding productivity.
We’re Here to Help
We warmly welcome any inquiries regarding product specifications or pricing.
With English-speaking staff on our team, we’re well-prepared to assist you efficiently and clearly.
Please don’t hesitate to contact me directly — I will personally respond to your email.
You can reach me at: hy.kang@kovistek.com