WCA-800 Automatic Water Contact Angle Measurement System

The Ultimate Solution for Semiconductor Packaging Process Quality & Reliability

The WCA-800 is a high-precision, fully automatic water contact angle (WCA) measurement system,
designed to evaluate the surface wettability of key materials used in semiconductor packaging processes.

By accurately analyzing hydrophilicity and hydrophobicity on various substrates—such as wafers, lead frames, and PCBs—
the WCA-800 enables process optimization and quality stabilization across the entire manufacturing workflow.

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✅ Key Features

✔ Fully Automated Measurement Process

• Automatic sample positioning (X/Y/R axis)

• Automated droplet dispensing

• Auto-report generation and storage
  → Minimizes operator intervention and ensures high repeatability.

✔ High-Precision Analytical Performance

• Contact angle accuracy: ±0.5˚

• Repeatability: ±0.1˚

• Dimensional measurement accuracy: ±0.1mm

✔ Broad Sample Compatibility

• Supports up to 12-inch wafers, lead frames, PCB substrates, and more

• Ideal for plasma treatment validation, bonding inspection, and pre-packaging process evaluations

✔ Statistical Process Control (SPC) Functionality

• Provides detailed statistical analysis: average, variance, standard deviation for contact angle, height, width, and area

• Facilitates data-driven process monitoring and quality control

✔ User-Friendly Interface

• Windows 10-based intuitive software platform

• Equipped with Circle Fitting Algorithm for precise and stable measurements

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✅ Application Benefits

● Surface Cleanliness Assessment

• Quantitatively evaluates the effectiveness of cleaning processes

• Establishes objective cleanliness standards

● Enhanced Bonding Reliability

• Diagnoses surface conditions before bonding to minimize defects

• Verifies hydrophilicity improvements with clear data

● Underfill Process Optimization

• Assesses underfill material spreadability to reduce voids and cracks

• Contributes to improved product durability and extended lifespan

● Surface Treatment Effectiveness Verification

• Compares pre- and post-plasma treatment conditions for process optimization

• Visualizes surface energy changes with precise numerical data

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✅ Product Specifications

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✅ Why WCA-800 Is More Than Just a Measurement Tool

The WCA-800 goes beyond simple contact angle measurement.
It serves as a strategic solution for comprehensive quality control and process optimization
in semiconductor packaging processes.

It plays a crucial role in customer support, process analysis, and quality assurance,
especially in critical processes such as plasma treatment, bonding, and underfill evaluations.

 

We’re Here to Help
We warmly welcome any inquiries regarding product specifications or pricing.
With English-speaking staff on our team, we’re well-prepared to assist you efficiently and clearly.
Please don’t hesitate to contact me directly — I will personally respond to your email.
You can reach me at: hy.kang@kovistek.com